• Computational Methods, EM Theory and Modeling: Integral equation/differential equation, time domain/frequency domain, hybrid and multi-physics, low frequency and high frequency techniques, optimization techniques, quantum EM, Bio-EM, parallel and distributed computations, AI in EM;
• Antennas and Propagation: Small Antennas, wideband and multiband antennas, antenna arrays, dielectric resonator antennas, MIMO antennas, RFID antennas, space and satellite antennas, wearable antennas, bio-antennas, scattering and propagation, AI for antennas and arrays;
• Passive Components and Packaging: Planar passive components, non-planar passive components, integrated passive circuits, microwave/RF filters, resonators, power combiners/dividers, waveguides and transmission lines, passive device modelling and simulations, microwave acoustic, ferrite, ferroelectric, phase-change, MEMS components, RF MEMS, LTCC devices, MCMs, metamaterials and EBG structures, liquid crystal polymer, 3D and inkjet printing, fan-out wafer packaging, glass substrate and others;
• Active Devices and Circuits: Semiconductor devices, low-noise devices and circuits, high-power devices and circuits, wide bandgap devices, device modelling and characterization, MMICs, RFICs, millimeter and terahertz wave devices and circuits, RF circuits for quantum computing, AI for active circuits, and others;
• Nano-Photonics and Quantum Devices: Photonic integrated circuits, photonic crystals and nanocavities, 2D materials, III-V and wide bandgap materials, emerging quantum devices and systems, nonlinear and ultrafast nanophotonics, perovskite nanophotonics and optoelectronics;
• Metamaterials and Non-Hermitian Physics: Metamaterials, metaphotonics and intelligent metastructures, inverse design and machine-learning-assisted metastructures, adaptive smart materials, time varying metamaterials and metasurfaces, reconfigurable intelligent surfaces, non-hermitian physics, bound states in the continuum, exceptional points;
• EMC and Signal/Power Integrity: EMC modeling and simulation, EMI mitigation and filtering, signal integrity for high-speed electronics, power integrity in heterogenous integrated circuits and systems;
• Microwave Radar and Sensing: Microwave remote sensing, DoA, SAR algorithms and systems, inverse scattering, Radar techniques, Bio-Radar, AI for smart sensing, and others;
• Microwave Measurement: Near-field techniques, microscopy, microwave measurement techniques, microwave properties characterization of materials, and others;
• Systems and Applications: 5G and 6G systems, IoT/RFID systems IoTs, biomedicine, brain-machine interface, millimeter and terahertz wave systems, microwave photonics, AR/VR, MRI, satellite systems, low-attitude economics, wireless power transfer, security and health monitoring systems, autonomous driving systems and others.

Paper Submission:
Prospective authors are invited to submit manuscripts in electronic (PDF) format.All papers must be written in English. Please submit one-page abstract or full paper of up to 3 pages including text, reference, and figures. All papers will be peer reviewed and will be included in ACES and indexed by Engineering Index (EI) after presentation at the conference.