ANNOUNCEMENTS

Click HERE for the Call-for-Papers.

Click HERE for the template of Special Session Proposal (Deadline: Apr 30, 2026).

2026 International Applied Computational Electromagnetics Society Symposium (ACES-China 2026) is organized by City University of Hong Kong (CityUHK) Qingdao Research Institute, and co-organized by Nanjing University of Aeronautics and Astronautics (NUAA), Harbin Engineering University (HEU) and Ceyear Technologies Co. Ltd. ACES-China 2026 is a continuation of a series of annual conference held in Suzhou (2017), Beijing (2018), Nanjing (2019), Chengdu (2021), Xuzhou (2022), Hangzhou (2023) and Xi'an (2024), Huangshan (2025).

ACES-China 2026 will be held in Qingdao, China on August 21-24, 2026. ACES-China 2026 will feature both invited and contributed papers. Distinguished researchers will be invited to deliver keynote speeches on technology trends and significant advances in relevant topics. Contributed papers are solicited for the same topics as listed below.

Topics:
The topics include, but are not limited to, the following technical areas:
• Computational Methods, EM Theory and Modeling: Integral equation/differential equation, time domain/frequency domain, hybrid and multi-physics, low frequency and high frequency techniques, optimization techniques, quantum EM, Bio-EM, parallel and distributed computations, AI in EM;
• Antennas and Propagation: Small Antennas, wideband and multiband antennas, antenna arrays, dielectric resonator antennas, MIMO antennas, RFID antennas, space and satellite antennas, wearable antennas, bio-antennas, scattering and propagation, AI for antennas and arrays;
• Passive Components and Packaging: Planar passive components, non-planar passive components, integrated passive circuits, microwave/RF filters, resonators, power combiners/dividers, waveguides and transmission lines, passive device modelling and simulations, microwave acoustic, ferrite, ferroelectric, phase-change, MEMS components, RF MEMS, LTCC devices, MCMs, metamaterials and EBG structures, liquid crystal polymer, 3D and inkjet printing, fan-out wafer packaging, glass substrate and others;
• Active Devices and Circuits: Semiconductor devices, low-noise devices and circuits, high-power devices and circuits, wide bandgap devices, device modelling and characterization, MMICs, RFICs, millimeter and terahertz wave devices and circuits, RF circuits for quantum computing, AI for active circuits, and others;
• Nano-Photonics and Quantum Devices: Photonic integrated circuits, photonic crystals and nanocavities, 2D materials, III-V and wide bandgap materials, emerging quantum devices and systems, nonlinear and ultrafast nanophotonics, perovskite nanophotonics and optoelectronics;
• Metamaterials and Non-Hermitian Physics: Metamaterials, metaphotonics and intelligent metastructures, inverse design and machine-learning-assisted metastructures, adaptive smart materials, time varying metamaterials and metasurfaces, reconfigurable intelligent surfaces, non-hermitian physics, bound states in the continuum, exceptional points;
• EMC and Signal/Power Integrity: EMC modeling and simulation, EMI mitigation and filtering, signal integrity for high-speed electronics, power integrity in heterogenous integrated circuits and systems;
• Microwave Radar and Sensing: Microwave remote sensing, DoA, SAR algorithms and systems, inverse scattering, Radar techniques, Bio-Radar, AI for smart sensing, and others;
• Microwave Measurement: Near-field techniques, microscopy, microwave measurement techniques, microwave properties characterization of materials, and others;
• Systems and Applications: 5G and 6G systems, IoT/RFID systems IoTs, biomedicine, brain-machine interface, millimeter and terahertz wave systems, microwave photonics, AR/VR, MRI, satellite systems, low-attitude economics, wireless power transfer, security and health monitoring systems, autonomous driving systems and others.

Important Dates:

Paper Submission Deadline: Mar 31, 2026   Apr 30, 2026

Qingdao, China